Test Engineer

We are looking for a Munich based IC Test Engineer for our customer in Munich, Germany. This opportunity requires an onsite presence at the customer's site at least 3 days per week, every week. The role can be contract or contract to permanent.

Must have working rights for Germany or EU. Candidates available on a remote basis only will not be considered. Responsibilities Partner with design teams from early development stages to review DFX architecture and define comprehensive test requirements.

Develop test methodologies and generate test content for high-speed embedded IP interfaces (LPDDR4/5, PCIe Gen4/5, MIPI D/C/MPHY). Perform test program development, pattern conversion, and pre‑silicon validation (virtual simulations). Support load board and probe card design.

Lead post‑silicon debug to enable timely delivery of samples to internal and external customers. Drive test characterization and optimization to meet automotive quality standards. Collaborate with Quality & Reliability teams to execute qualification plans efficiently.

Lead production test deployment with tier‑one foundries and OSATs for high‑volume wafer sort and final test operations. Requirements BSc or MSc in Electrical Engineering. 7+ years of experience in IC Product/Test Engineering. Proven hands‑on experience in bring‑up and productization of complex ICs.

Experience with Teradyne UltraFlex/UltraFlexPlus would be a strong advantage. Deep knowledge of structural DFT methodologies (Scan, MBIST, JTAG). Proficiency in C/C++ and scripting (Python, Perl) in a Unix environment.

Strong data and yield analysis skills using statistical tools (e.g., JMP). Familiarity with Verilog and RTL simulations would be an advantage. If this role is a match to your skillset, please email me for more information [email protected], along with your updated CV.

Principal Analog AMS RF Recruitment Specialist #J-18808-Ljbffr