RFIC Packing Engineer (Lowell)

Responsibilities: Technical lead for RF/microwave plastic, ceramic, laminate and metal packages Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality Troubleshoot IC packaging defects, then define and implement solutions Provide supplier benchmarking and tracking data to drive backend technology roadmap Qualifications: MS or BS +3 years of experience in Materials Science, EE/ME with advanced IC package process development, design and thermal analysis with emphasis on RF and Microwave IC’s Proven track record of successfully driving package design/development activities from concept to implementation Experience working with high-volume contract manufacturers in developing processes or resolving technical issues Experience in package design and development including strong understanding of relationship between materials and package performance