Failure Analysis Engineer at Burlington Facility

Become a Failure Analysis Engineer at our Burlington, ON facility, dedicated to analyzing analog and mixed-signal ICs from both customers and internal failures. This on-site role emphasizes technical acumen and hands-on skills. As a Failure Analysis Engineer, you will be responsible for executing package and die level analysis while leveraging your academic foundation in Engineering Physics or Electrical Engineering.

With over 3 years of experience in semiconductor IC failure analysis, your proficiency with essential FA equipment will support accurate troubleshooting and resolution of IC issues. Key Responsibilities: • Execute package and die level failure analysis tasks • Document findings through formal reports for stakeholders • Collaborate with engineering teams for technical support • Support ongoing advancements in FA processes • Oversee laboratory supplies and equipment standards Requirements: • Bachelor’s degree in relevant engineering discipline • Minimum 3 years experience in semiconductor analysis • Expertise in operating specialized failure analysis equipment • Excellent communication and analytical skills • Willingness to work in a laboratory environment Leverage your engineering skills to enhance fail-safe processes and technical reporting at our Burlington facility. #J-18808-Ljbffr