SMT Principal Engineer

Job Summary The SMT Principal Engineer I at Jabil, Inc. is a senior technical contributor responsible for leading advanced surface mount technology (SMT) process development, optimization, and continuous improvement initiatives across multiple manufacturing lines to ensure high-quality and efficient production of complex electronic assemblies. Job Responsibilities * Lead the development, implementation, and optimization of SMT processes, including paste printing, pick-and-place FUJI, reflow soldering, and post-reflow inspection (AOI, X-ray). * Conduct in-depth analysis of SMT process data, identifying root causes of defects and implementing effective corrective and preventive actions. * Develop and qualify new SMT equipment, materials, and processes, ensuring seamless integration into existing production environments. * Provide expert technical guidance and mentorship to junior engineers and production teams on SMT best practices, troubleshooting, and process control. * Collaborate with design engineering, supply chain, and quality departments to ensure manufacturability (DFM) of new products and resolve SMT-related design issues. * Drive continuous improvement projects utilizing methodologies such as Six Sigma, Lean Manufacturing, and SPC to enhance SMT yield, throughput, and reliability. * Author and maintain comprehensive SMT process documentation, including work instructions, process specifications, and failure analysis reports. * Evaluate and implement new SMT technologies and industry trends to maintain Jabil's competitive edge and address evolving product requirements. * Lead efforts in root cause analysis for complex SMT failures, implementing robust solutions to prevent recurrence. * Represent Jabil in technical discussions with customers and suppliers regarding SMT process capabilities and new product introductions. Job Qualifications * Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field.

Master's degree preferred. * 8-12 years of progressive experience in SMT process engineering within a high-volume electronics manufacturing environment. * Strong Knowledge of FUJI Setup, Nexim and Valor * Demonstrated expertise in SMT equipment operation, programming, and maintenance, including printers, pick-and-place machines (e.g., Fuji, Programming, etc.), reflow ovens, and inspection systems (AOI, SPI, X-ray). * In-depth knowledge of various soldering technologies, solder paste chemistries, and component packaging. * Proven track record of leading process improvement projects and achieving significant yield and cost reductions. * Strong analytical and problem-solving skills with a data-driven approach to decision-making (e.g., SPC, DOE). * Excellent communication, interpersonal, and presentation skills, with the ability to effectively collaborate with cross-functional teams and external stakeholders. * Proficiency in statistical analysis software (e.g., Minitab, JMP) and CAD software for DFM analysis. * Familiarity with industry standards such as IPC-A-610 and J-STD-001. * Ability to work independently and manage multiple complex projects simultaneously.