Principal Optoelectronic Packaging Engineer

Job Description Job Description Principal Optoelectronic Packaging Engineer Location: San Diego, CA | Santa Clara, CA | Colorado Springs, CO Relocation Assistance Available: The preferred location for this position is in San Diego/Vista, CA . At this site, the salary range is $187,000 – $212,000 annually , based on experience, plus generous bonuses paid three times per year (February, August, and late fall). A secondary option is in Santa Clara, CA , where the salary range is $220,000 – $250,000 annually , based on experience, plus the same bonus structure.

The third location is in Colorado Springs, CO , with a salary range of $159,000 – $180,000 annually , based on experience, plus bonuses as noted above. Relocation assistance is available only for moves to the preferred location (San Diego/Vista, CA). About the Opportunity An industry-leading technology company is seeking a Principal Optoelectronic Packaging Engineer to lead the development of next-generation optical and photonic packaging solutions.

This is a highly visible technical leadership role responsible for driving advanced packaging architectures, manufacturing processes, and technology roadmaps for innovative optoelectronic products serving commercial, aerospace, defense, telecommunications, and high-performance computing markets. This position offers the opportunity to work with cutting-edge optical technologies while influencing product strategy from concept through production. Key Responsibilities Lead the design and development of advanced optoelectronic packaging solutions for next-generation products.

Develop packaging architectures utilizing semiconductor, optical, and interconnect technologies. Research and evaluate emerging materials, manufacturing processes, and packaging technologies. Drive process development efforts from prototype through high-volume manufacturing.

Establish and document robust assembly and manufacturing processes using Design of Experiments (DOE), FMEA, and Six Sigma methodologies. Collaborate with engineering, operations, manufacturing, and product management teams to ensure successful product launches. Support reliability testing, qualification activities, and root cause investigations.

Transfer scalable manufacturing processes to domestic and international production facilities. Mentor and develop engineers in packaging, assembly, and process development disciplines. Interface with suppliers, equipment vendors, and strategic technology partners.

Required Qualifications Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or related technical discipline. 15+ years of engineering experience within optoelectronics, photonics, semiconductor packaging, microelectronics, or related advanced technology environments. Demonstrated experience developing complex packaging and assembly solutions for optical, photonic, or semiconductor products. Strong understanding of materials, interconnect technologies, and assembly processes.

Experience supporting products from research and development through manufacturing transfer. Knowledge of reliability testing, failure analysis, and process qualification methodologies. Excellent communication, leadership, and cross-functional collaboration skills.

Preferred Qualifications Experience with optical transceivers, photonic integrated circuits (PICs), silicon photonics, or optical modules. Knowledge of advanced packaging technologies such as flip-chip, wire bonding, die attach, wafer-level packaging, 2.5D/3D integration, or heterogeneous integration. Experience with automated assembly equipment and manufacturing process optimization.

Six Sigma, Lean Manufacturing, or Design for Manufacturability (DFM) experience. Background supporting aerospace, defense, telecommunications, data center, or high-performance computing applications. What You'll Bring Technical leadership and innovation mindset.

Ability to translate emerging technologies into manufacturable products. Strong analytical and problem-solving capabilities. Passion for developing next-generation photonic and optoelectronic solutions.

Ability to thrive in a collaborative, fast-paced engineering environment. Competitive compensation, performance bonuses, comprehensive benefits, retirement programs, and relocation assistance available. #Optoelectronics #Photonics #SemiconductorPackaging #AdvancedPackaging #EngineeringJobs #SiliconPhotonics #OpticalEngineering #ManufacturingEngineering #TechnologyCareers #ZipRecruiterJobs Company Description Gregg Carroll Recruiting Services, LLC is an independent executive search firm serving customers throughout the United States. Company Description Gregg Carroll Recruiting Services, LLC is an independent executive search firm serving customers throughout the United States.