Principal EDA Engineer (Austin)

Insight Global is looking for a Principal EDA Engineer, Product Management that will be working on site in Austin, TX and support a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc.

They are Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, they are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing. Responsibilities: Define and own the EDA implementation and roadmap for multi-component and chiplet integration platforms—spanning design kits, simulation tools, and reference flows from concept to deployment. Lead the technical development of comprehensive PDKs and ADKs, including modeling, verification, and enablement collateral to accelerate customer adoption of their technologies.

Act as a hands-on technical authority for EDA packaging workflows, bridging electrical, thermal, and mechanical simulation domains. Drive cross-functional collaboration with engineering, packaging design, product marketing, and major EDA vendors (Synopsys, Cadence, Ansys, Siemens) to ensure design enablement flows are aligned, validated, and continuously improved. *Candidates must be able to work on our client's W2 without sponsorship now and in the future* Desired Traits: 7+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, or advanced packaging workflows. Strong customer engagement and strategy within EDA Deep technical expertise with Synopsys, Cadence, Ansys, or Siemens design flows for chiplet and heterogeneous integration.

Built and deployed PDKs/ADKs and understand the nuances of modeling, simulation, and qualification across electrical, RF, mechanical, and thermal domains. BS or MS in Electrical Engineering, Computer Engineering, or related discipline. Advanced degrees are a plus Compensation: $200,000 to $220,000 per year annual salary.

Exact compensation may vary based on several factors, including skills, experience, and education.