Package Assembly Integration Engineer

Job Overview This role requires regular onsite presence to drive systems development, business processes, and tactical execution for EMIB‑T OR and CH factories. The incumbent will conduct feasibility and FMEA studies, select and develop materials and equipment, plan and execute experiments, identify integrated process solutions, qualify new products, transfer technology from fabrication, and leverage big‑data analysis to improve manufacturing performance. Collaboration with product engineering, module engineering, suppliers, and partners is essential to meet technology roadmaps.

Responsibilities Drive systems development, business processes, and tactical execution for EMIB‑T OR and CH factories. Conduct feasibility and FMEA studies to develop integrated process solutions for safety, quality, reliability, and output requirements for high‑volume manufacturing transfer. Select and develop material and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.

Plan and conduct experiments to fully characterize the process throughout the development cycle and improve performance for each specific product. Identify integrated process solutions to resolve issues or specific requests from customers by partnering with innovators in product engineering and module engineering teams. Conduct new product qualification and technology transfers from fabrication operations.

Leverage big‑data analysis to identify process design weaknesses and/or manufacturing tool issues and propose corrective, data‑based solutions. Collaborate and engage with development and material suppliers, and partners to develop processes and equipment needs to meet technology roadmaps. Ideal Candidate Demonstrates Strong problem‑solving and analytical skills with ability to analyze data and reformulate plans.

Strong written and verbal communication skills. Organizational skills to manage multiple products/projects in parallel, including schedules and detailed build plans. Job Details Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Work Model This role will require an on‑site presence.

Minimum Qualifications Bachelor’s degree in natural science, engineering discipline, or related STEM field with 5+ years of industry experience or a Master’s degree with 3+ years of industry experience. Industry experience should include experience in EMIB package assembly, substrate design, or manufacturing. Preferred Qualifications Extensive knowledge of package assembly and packaging technology/process flows.

Previous related work experience in a semiconductor foundry. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry.

It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range For jobs which could be performed in the US: $155,520.00 – $255,200.00 USD.

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. #J-18808-Ljbffr