New Product Introduction Engineer

Responsibilities:

1. new semiconductor package project implement on Memory product ( DRAM, Flash, LPDDR, eMMC, UFS) in Sao Paulo, Brazil.
2. Link China customer requirement spec with Process engineering for the new product implement.
3. Coordinate with PM、RD、QA, supplier team, make sure engineering mission and project running on schedule.
4. Support the qualification reliability test verification items and fail sample Failure analysis.
5. Support engineering verification , process issue analysis and quality improvement.
6. Support to engineering team to communicate with China, Taiwan material and machine vendor in Chinese.

Requirement:

1. Have NPI or semiconductor package process experience more than 5 years.
2. Know the NPI , engineering verification, product implement or process improvement flow.
3. Have semiconductor package process, reliability test, yield improvement, failure analysis experience.
4. Possesses cross-departmental coordination skills on new package project.
5. Have the process issue analysis, engineering judgement, project tracking, schedule control capability.
6. Have DRAM, Flash, LPDDR5, eMMC, UFS package NPI or process engineering experience is good.
7. Have China working experience and work with China customer experience.
8. Need work in Sao Paulo, Brazil.
9. Skill in English and Chinese language.