Electro Mechanical Engineer (Springfield)

300 mm wafer handling design (edge‑grip, vacuum, kinematic support) Precision chuck design & compliant mechanisms FEA (ANSYS, Abaqus, COMSOL) — stress, modal, and contact analysis Modeling warped/bowed wafers, thin‑plate mechanics Cleanroom design principles – ISO Class 1, low‑particle mechanisms Vacuum system design, leak‑tight sealing, He‑leak testing Material selection for semiconductor tools: PEEK, Vespel, PTFE, PPS Alumina, Aluminum Nitride, Ti‑6Al‑4V Hard anodize, DLC, TiN, Parylene coatings Motion system design: Linear motors, voice‑coil actuators, pneumatic micro‑actuators Flexures, guides, cross‑roller bearings Jerk‑limited (S‑curve) motion and soft‑landing control Edge‑grip mechanism design with low clamping forces Tolerance analysis, GD&T, DFMEA, DOE Semiconductor standards familiarity: SEMI M1, M49, E57, E84, ISO 14644 Metrology & Testing Skills Warp, bow, TTV measurement techniques Particle measurement and contamination control Vacuum integrity tests (helium mass spectrometer, pressure decay) Wafer alignment and edge detection sensors (optical/capacitive) Reliability testing for 24/7 fab duty